Yogi Adityanath set to lay foundation of semiconductor unit off Yamuna e-way on Feb 21

Noida: The foundation stone of a semiconductor manufacturing unit by a joint venture of HCL Group and Foxconn will be laid in Sector 28 of Yamuna Expressway Industrial Development Authority (YEIDA) area on Feb 21.Prime Minister Narendra Modi is expected to address the gathering via video conferencing. Chief minister Yogi Adityanath and Union IT and electronics minister Ashwini Vaishnaw will attend the event at the project site.The project, to be implemented through a joint venture company, India Chip Pvt Ltd, involves an investment of Rs 3,706 crore. The state govt allotted 48 acres in Sector 28 to the company for setting up the plant.The facility is among 6 semiconductor manufacturing units approved by the Centre under the India Semiconductor Mission. The unit will manufacture display driver chips used in mobile phones, laptops, personal computers, automobiles, and a range of other devices with display panels. The plant is designed for a capacity of 20,000 wafers per month, with a design output of 36 million display driver chip units a month.Officials said the plant was expected to generate around 3,780 jobs once fully operational.The unit will require substantial infrastructure support. It will need 19,000 KVA of electricity daily, while water requirement is projected at around 2,000 MLD. The project is expected to catalyse the development of an electronics and semiconductor cluster in YEIDA region, particularly with its proximity to the upcoming Noida airport.